RO3003 PCB – 4-Layer 1.6mm Thick High-Frequency PCB for Automotive Radar and 5G Applications
1.Unlock Next-Level Performance with Rogers RO3003 High-Frequency PCBs
Rogers RO3003 laminates are ceramic-filled PTFE composites designed for high-frequency RF and microwave applications, offering exceptional stability of dielectric constant (Dk) across various temperatures and frequencies. With a Dk of 3.0 ±0.04 and a dissipation factor of 0.001 at 10 GHz, RO3003 is the ideal choice for automotive radar (77 GHz), 5G wireless infrastructure (mmWave), and advanced driver assistance systems (ADAS).
This 4-layer rigid PCB features a 1.6mm thickness, 1oz copper layers, and immersion silver surface finish, ensuring superior performance, reliability, and cost-effectiveness for your high-frequency designs.
2.Key Features of RO3003 Laminates
Dielectric Constant (Dk): 3.0 ±0.04 at 10 GHz/23°C
Dissipation Factor (Df): 0.001 at 10 GHz/23°C
Thermal Conductivity: 0.5 W/mK
Low Moisture Absorption: 0.04%
CTE: X-axis: 17 ppm/°C, Y-axis: 16 ppm/°C, Z-axis: 25 ppm/°C
Decomposition Temperature (Td): >500°C
Coefficient of Thermal Expansion (-55 to 288 °C)：X axis 17 ppm/°C, Y axis 16 ppm/°C, Z axis 25 ppm/°C
3.Why Choose RO3003 Laminates?
Low Dielectric Loss: Ideal for applications up to 77 GHz.
Excellent Mechanical Properties: Reliable for stripline and multi-layer board constructions.
Stable Dk Over Temperature and Frequency: Perfect for band-pass filters, microstrip patch antennas, and voltage-controlled oscillators.
Low In-Plane Expansion Coefficient: Matches copper for reliable surface-mounted assemblies.
Cost-Effective: Economical pricing for volume manufacturing.
4.PCB Stackup: 4-layer rigid PCB
| Specification | Details |
|---|---|
| Copper Layer 1 | 35 μm |
| Rogers RO3003 Substrate | 5 mil (0.127 mm) |
| Copper Layer 2 | 35 μm |
| Prepreg | 4 mil (0.102 mm) |
| Copper Layer 1 | 35 μm |
| Rogers RO3003 Substrate | 50 mil (1.27 mm) |
| Copper Layer 2 | 35 μm |
5.PCB Construction details:
- Board dimensions: 110.9mm x 110.9 mm=1PCS
- Minimum Trace/Space: 4/5 mils
- Minimum Hole Size: 0.25mm
- No Blind vias.
- Finished board thickness: 1.64mm
- Finished Cu weight: 1 oz (1.4 mils) outer layersB
- Via plating thickness: 20 μm
- Surface finish: Immersion Silver
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% El4ectrical test used prior to shipment
6.PCB Statistics:
Components: 37
Total Pads: 193
Thru Hole Pads: 135
Top SMT Pads: 58
Bottom SMT Pads: 0
Vias: 79
Nets: 2
7.Type of artwork supplied: Gerber RS-274-X
8.Accepted standard: IPC-Class-2
9.Availability: worldwide
10.Applications of RO3003 Laminates
Automotive Radar Systems (77 GHz)
5G Wireless Infrastructure (mmWave)
Global Positioning Satellite AntennasB
Cellular Telecommunications Systems
Patch Antennas for Wireless Communications
Direct Broadcast Satellites
Power Backplanes
11.Upgrade Your RF PCB Designs with RO3003 Laminates!
Whether you're working on automotive radar, 5G infrastructure, or wireless communications, Rogers RO3003 laminates offer the perfect combination of performance, reliability, and cost efficiency. With low dielectric loss, stable Dk over temperature and frequency, and excellent mechanical properties, RO3003 is the ideal choice for your next high-frequency PCB project.